On the basis of introducing the performance requirement that is to be reached in the low-rigidity Quartz Flex Accelerometer's Chip machining, the technical difficulties in machining are brought forward, the polished dressing, etching process, laser cutting and chip coating are analyzed in depth, and the detailed technical realization and corresponding measures are also presented. At last, the main technical points in the working procedure are summarized. The idea of syncretizing the working procedure is also brought forward. The stability is established for the high-performance low-rigidity quartz accelerometer's chip machining.