基于拉伸率的3DVSP道集切除技术及应用
|
3DVSP channel gather cutting technique based on tensile ratio and its application
|
图11. 拉伸率超过1.0道集切除前后频谱对比 |
Fig.11. Spectral comparison before and after the resection of the tensile ratio exceeding 1.0 |
![]() |